Technical Committee

Real-Time/Embedded Operating Systems

Li-Pin Chang, National Chiao-Tung University, Taiwan
lpchang@cs.nctu.edu.tw

Tien-Fu Chen, National Chung Cheng University, Taiwan
chen@cs.ccu.edu.tw
Guohui Li, Huazhong Universatyof Science & Technology, China
guohuili@hust.edu.cn
Jihong Kim, Seoul National University, Korea
jihong@davinci.snu.ac.kr
Kyu Ho Park, Korea Advanced Institute of Science and Technology, Korea
kpark@ee.kaist.ac.kr
Guohui Li, Huazhong University of Science & Technology, China
guohuili@hust.edu.cn
Sam Hyuk Noh, Hong-Ik University, Korea
samhnoh@hongik.ac.kr
Stephen A. Edwards, Columbia University, USA
sedwards@cs.columbia.edu
Sree. Rajan, Fujitsu Laboratories of America, USA
sree.rajan@us.fujitsu.com
Tai-Yi Huang, National Tsing Hua University, Taiwan
tyhuang@cs.nthu.edu.tw
Ying-Dar Lin, National Chiao-Tung University, Taiwan
ydlin@cis.nctu.edu.tw


Power-Aware Computing

X. Sharon Hu, University of Notre Dame, USA
shu@cse.nd.edu

Chris Poellabauer, University of Notre Dame, USA
cpoellab@cse.nd.edu
Chi-Ying Tsui, Hong Kong University of Science and Technology, Hong Kong
eetsui@ee.ust.hk
Tianzhou Chen, Zhejiang University, China
tzchen@zju.edu.cn
Gang Quan, University of South Carolina, USA
gquan@cse.sc.edu
Joerg Henkel, Univeristy of Karlsruhe, Germany
henkel@informatik.uni-karlsruhe.de
Kanishka Lahiri, NEC Laboratories America, USA
klahiri@montalvosystems.com
Luca Benini, University of Bologna, Italy
lbenini@deis.unibo.it
Pai Chou, University of California, Irvine, USA
phchou@uci.edu
Vijaykrishnan Narayanan, Penn State University, USA
vijay@cse.psu.edu
Yung-Hsiang Lu, Purdue University, USA
yunglu@purdue.edu


Embedded System Software & Optimization

Jinsoo Kim, Korea Advanced Institute of Science and Technology, Korea
jinsoo@cs.kaist.ac.kr

Pete Beckman, Argonne National Laboratory, USA
beckman@mcs.anl.gov
Francois Bodin, IRISA, France
bodin@irisa.fr
Jinsung Cho, Kyung Hee University, Korea
chojs@khu.ac.kr
Chanik Park, Samsung, Electronics, Korea
ci.park@samsung.com
Hwansoo Han, Korea Advanced Institute of Science and Technology, Korea
hshan@cs.kaist.ac.kr
Jenq-Kuen Lee, National Tsing-Hua University, Taiwan
jklee@cs.nthu.edu.tw
Rong-Guey Chang, National Chung-Cheng University, Taiwan
rgchang@cs.ccu.edu.tw
Stephen A. Edwards, Columbia University, USA
sedwards@cs.columbia.edu
Sungsoo Lim, Kookmin University, Korea
sslim@kookmin.ac.kr
Yeh-Ching Chung, National Tsing-Hua University, Taiwan
ychung@cs.nthu.edu.tw


Embedded System Architectures

Dongsheng Wang, Tsinghua University, China
wds@tsinghua.edu.cn

Achim Rettberg, University of Paderborn, Germany
achim@c-lab.de
Guangzuo Cui, Peking University, China
cgz@pku.edu.cn
Franz Rammig, University of Paderborn, Germany
franz@uni-paderborn.de
Yunde Jia, Beijing Institute of Technology, China
jiayunde@bit.edu.cn
Junzhao Sun, University of Oulu, Finland
junzhao.sun@ee.oulu.fi
Mingyu Lu, Dalian maritime University, China
lumingyu@tsinghua.org.cn
Huadong Ma, Beijing University of Posts and Telecommunications, China
mhd@bupt.edu.cn
Neil Bergmann, The University of Queensland, Australia
n.bergmann@itee.uq.edu.au
Roger Woods, Queen's University of Belfast Belfast, UK
r.woods@qub.ac.uk
Rajesh Gupta, University of California, USA
rgupta@ucsd.edu
Ming Xu, National University of Defense Technology, China
xuming64@public.cs.hn.cn
Xiao Zong Yang, Harbin Institute of Technology, China
xzyang@hit.edu.cn
Yingfei Dong, University of Hawaii, USA
Yingfei@hawaii.edu
Zoran Salcic, University of Auckland, New Zealand
z.salcic@auckland.ac.nz
Zhimin Zhang, Chinese Academy of Sciences, China
zzm@ict.ac.cn


Embedded and Reconfigurable Hardware

Hiroyuki Tomiyama, Nagoya University, Japan
tomiyama@is.nagoya-u.ac.jp

Adam Donlin, Xilinx, USA
adam.donlin@xilinx.com
Chia-Tien Dan Lo, University of Texas at San Antonio, USA
danlo@ieee.org
Elaheh Bozorgzadeh, University of California, Irvine, USA
eli@ics.uci.edu
Shinya Honda, Nagoya University, Japan
honda@ertl.jp
Yin-Tsung Hwang, National Yunlin University of Science and Technology, Taiwan
hwangyt@yuntech.edu.tw
Ing-Jer Haung, National Sun Yat-Sen University, Taiwan
ijhuang@cse.nsysu.edu.tw
Koji Inoue, Kyushu University, Japan
inoue@i.kyushu-u.ac.jp
Ki-Seok Chung, Hanyang University, Korea
kchung@hanyang.ac.kr
Yuichiro Shibata, Nagasaki University, Japan
shibata@cis.nagasaki-u.ac.jp


HW/SW Co-design and Design Automation

Samarjit Chakraborty, National University of Singapore, Singapore
samarjit@comp.nus.edu.sg

Twan Basten, Eindhoven University of Technology, Nethelands
A.A.Basten@tue.nl
Andy Pimentel, University of Amsterdam, Netherlands
andy@science.uva.nl
Aviral Shrivastava, Arizona State University, USA
Aviral.Shrivastava@asu.edu
Chi-Ying Tsui, Hong Kong University of Science and Technology, Hong Kong
eetsui@ee.ust.hk
Karam S. Chatha, Arizona State University, USA
kchatha@asu.edu
Mathias Gries, Intel Corp., Germany
matthias.gries@intel.com
M. Balakrishnan, IIT Delhi, India
mbala@cse.iitd.ernet.in
Miguel Miranda, IMEC, Belgium
miranda@imec.be
Naehyuck Chang, Seoul National University, Korea
naehyuck@snu.ac.kr
Soumitra K. Nandy, Indian Institute of Science, India
nandy@serc.iisc.ernet.in
Marco Platzner, University of Paderborn, Germany
platzner@upb.de
Christian Plessl, ETH Zurich, Switzerland
plessl@tik.ee.ethz.ch
Prabhat Mishra, University of Florida, USA
prabhat@cise.ufl.edu
Sri Parameswaran, University of New South Wales, Australia
sridevan@cse.unsw.edu.au
Hiroto Yasuura, Kyushu University, Japan
yasuura@c.csce.kyushu-u.ac.jp
Zonghua Gu, Hong Kong University of Science and Technology, Hong Kong
zgu@cse.ust.hk


Sensor Networks

Yu-Chee Tseng, National Chiao-Tung University, Taiwan
yctseng@cs.nctu.edu.tw

Chih-Min Chao, National Taiwan Ocean University, Taiwan
cmchao@ntou.edu.tw
Chien-Chung Shen, University of Delaware, USA
cshen@cis.udel.edu
Hsi-Lu Chao, Naitonal Chiao-Tung University, Taiwan
hlchao@cs.nctu.edu.tw
Hyuncheol Park, Information and Communication University, Korea
hpark@icu.ac.kr
Chung-Ta King, National Tsing Hua University, Taiwan
king@cs.nthu.edu.tw
Loren Schwiebert, Wayne State University, USA
loren@wayne.edu
Mario Cagalj, University of Split, Croatia
mario.cagalj@fesb.hr
Ming-Hour Yang, Chung Yuan University, Taiwan
mhyang@cycu.edu.tw
SAMEER S. TILAK, University of California, San Diego
sameer@sdsc.edu
Sandeep Gupta, Arizona State University, USA
Sandeep.Gupta@asu.edu
Jang-Ping Sheu, National Central University, Taiwan
sheujp@csie.ncu.edu.tw
Silvia Giordano, University of Applied Science - SUPSI, Switzerland
silvia.giordano@supsi.ch
Shih-Lin Wu, Chang Gung University, Taiwan
slwu@mail.cgu.edu.tw
Wang-Chien Lee, Penn State University, USA
wlee@cse.psu.edu
Yang Yang, University College London, Taiwan
y.yang@ee.ucl.ac.uk
Yuh-Shyan Chen, National Taipei University, Taiwan
http://www.cs.ccu.edu.tw/~shiwulo/euc07/yschen@csie.ntpu.edu.tw


Mobile Computing

Nicolas Navet, INRIA Lorraine, France
Nicolas.Navet@loria.fr

Ben A. Abderazek, National University of Electro-communications, Japan
ben@is.uec.ac.jp
Jiannong Cao, Hong-Kong Polytechnic University, Hong Kong
csjcao@comp.polyu.edu.hk
Eric Fleury, INRIA-INSA Lyon, France
Eric.Fleury@inria.fr
Guoliang Xing, City University of Hong-Kong, Hong Kong
glxing@cityu.edu.hk
Jean-Dominique Decotignie, Centre Suisse d'Electronique et de Microtechnique, Switzerland
jean-dominique.decotignie@csem.ch
Jiman Hong, Soongsil University, Korea
jiman@ssu.ac.kr
Luis Almeida, University of Aveiro, Portugal
lda@det.ua.pt
Lucia Lo Bello, University of Catania, Italy
lucia.lobello@diit.unict.it
Neil Audsley, University of York, UK
Neil.Audsley@cs.york.ac.uk
Simonot-Lion Francoise, LORIA-INPL, France
simonot@loria.fr


Agent and Distributed Computing

I-Ling Yen, University of Texas at Dallas, USA
ilyen@utdallas.edu

Alessio Bechini, University of Pisa, Italy
a.bechini@ing.unipi.it
Ann T. Tai, IA Tech., Inc., USA
a.t.tai@ieee.org
Ing-Ray Chen, Virginia Tech., USA
irchen@cs.vt.edu
Kane Kim, UC, Irvin, USA
khkim@uci.edu
Insup Lee, University of Pennsylvania, USA
lee@cis.upenn.edu
Yunhao Liu, Hong-Kong University of Science and Technology, Hong Kong
liu@cse.ust.hk
Neeraj Mittal, The University of Texas at Dallas, USA
neerajm@utdallas.edu
Shangping Ren, Illinois Institute of Technology, USA
ren@cs.iit.edu
Jeffrey Tsai, University of Illinois at Chicago, USA
tsai@cs.uic.edu
Dongfeng Wang, Wind River, USA
wtfm2000@gmail.com


Middleware & P2P

Cho-Li Wang, University of Hong-Kong, Hong Kong
clwang@cs.hku.hk

Bo Hong, Drexel University, USA
bohong@coe.drexel.edu
Ching-Hsien Hsu, Chung Hua University, Taiwan
chh@chu.edu.tw
Bin Xiao, Hong-Kong Polytechnic University, Hong Kong
csbxiao@comp.polyu.edu.hk
Jemal Abbawajy, Deakin University, Australia
Jemal@deakin.edu.au
Kuan-Ching Li, Providence University, Taiwan
kuancli@pu.edu.tw
Zhiling Lan, Illinois Institute of Technology, USA
lan@iit.edu
Yunhao Liu, Hong-Kong University of Science and Technology, Hong Kong
liu@cse.ust.hk
Yuanchun Shi, Tsinghua University, China
shiyc@tsinghua.edu.cn
Young-Sik Jeong , Wonkwang University, Korea
ysjeong@wku.ac.kr
Weisong Shi, Wayne State University, USA
weisong@cs.wayne.edu
Zhaohui Wu, Zhejiang University, China
wzh@zjuem.zju.edu.cn


Wireless Networks

Mohan Kumar, University of Texas at Arlington, USA
kumar@cse.uta.edu

Giusseppe Anastasi, University of Pisa, Italy
g.anastasi@iet.unipi.it
Manimaran Govindarasu, Iowa State University, USA
gmani@iastate.edu
Kwan-Wu Chin, Wollongong University, Australia
kwanwu@uow.edu.au
Mijeom Kim, Korea Telecom, Korea
mjkim@kt.co.kr
Nallasamy Mani, Monash University, Australia
Nallasamy.Mani@eng.monash.edu.au
Stephan Olariu, Old Dominion University, USA
olariu@cs.odu.edu
Cristina Pinotti, University of Perugia, Italy
pinotti@science.unitn.it
Swaroop Kalasapur, Samsung Research, USA
s.kalasapur@sisa.samsung.com
Sieteng Soh, Curtin University of Technology, Australia
soh@cs.curtin.edu.au
Yonghe Liu, University of Texas at Arlington, USA
yonghe@cse.uta.edu


Network Protocol

Ai-Chung Pang, National Taiwan University, Taiwan
acpang@csie.ntu.edu.tw

Jelena Misic, University of Manitoba, Canada
jmisic@cs.umanitoba.ca
Masayuki Murata, Osaka University, Japan
murata@ist.osaka-u.ac.jp
Noel Crespi, GET-INT, France
noel.crespi@int-evry.fr
Shun-Ren Yang, National Tsing-Hua University, Taiwan
sryang@cs.nthu.edu.tw
Andreas Terzis, Johns Hopkins University, USA
terzis@cs.jhu.edu
Yang Xiao, University of Alabama
http://www.cs.ccu.edu.tw/~shiwulo/euc07/yangxiao@ieee.org


Multimedia, Human-Computer Interface and Data Management

Joseph Ng, Hong-Kong Baptist University, Hong Kong
jng@comp.hkbu.edu.hk

Leonard Barolli, Fukuoka Institute of Technology, Japan
barolli@fit.ac.jp
Jong Hyuk Park, R&D Institute in Hanwha S&C Co., Ltd., Korea
parkjonghyuk@gmail.com
Clement Leung, Victoria University, Australia
Clement.Leung@vu.edu.au
Reynold Cheng, Hong-Kong Polytechnic University, Hong Kong
csckcheng@comp.polyu.edu.hk
Victor Lee, City University of Hong-Kong, Hong Kong
csvlee@cityu.edu.hk
David Tanier, Monash University, Australia
David.Taniar@infotech.monash.edu.au
Kazunori Takashio, Keio University, Japan
kaz@mkg.sfc.keio.ac.jp
Hidenori Nakazato, Waseda University, Japan
nakazato@waseda.jp
Seongsoo Hong, Seoul National University, Korea
sshong@filewood.snu.ac.kr
Tatsuo Nakajima, Waseda University, Japan
tatsuo@dcl.info.waseda.ac.jp
Timothy Shih, Tamkang University, Taiwan
tshih@cs.tku.edu.tw
Xu Jian Liang, Hong-Kong Baptist University, Hong Kong
xujl@comp.hkbu.edu.hk


Security & Fault Tolerance

Jiman Hong, Soongsil University, Korea
jiman@ssu.ac.kr

Jean-Philippe Martin, Microsoft Research, U.K.
jpmartin@microsoft.com
Andres Marin, University Carlos III of Madrid, Spain
amarin@it.uc3m.es
Roberto Di Pietro, University of Rome La Sapienza, Italy
dipietro@di.uniroma1.it
Zhenhai Duan, Florida State University, USA
duan@cs.fsu.edu
Geyong Min, University of Bradford, UK
g.min@brad.ac.uk
Gwangil Jeon, Korea Polytechnic University, Korea
gijeon@kpu.ac.kr
Haklin Kimm, East Stroudsburg University of Pennsylvania, USA
haklkimm@esu.edu
Hung-Chang Hsiao, National Tsing-Hua University, Taiwan
hchsiao@dns.csie.ncku.edu.tw
Heejun Ahn, Seoul National University of Technology, Korea
heejune@snut.ac.kr
Jordi Forne, Technical University of Catalonia, Spain
jforne@mat.upc.edu
Junghoon Lee, Cheju National University, Korea
jhlee@cheju.ac.kr
Klaus Kursawe, Katholieke University Leuven, Belgium
klaus.kursawe@esat.kuleuven.ac.be
Madjid Merabti, Liverpool John Moored University, UK
M.Merabti@ljmu.ac.uk
Marc Lacoste, France Telecom Division R&D, France
marc.lacoste@orange-ft.com
Emilia Rosti, University of Milan, Italy
rose@dico.unimi.it
Sangjun Lee, Soongsil University, Korea
sangjun@ssu.ac.kr
Willy Susilo, University of Wollongong, Australia
wsusilo@uow.edu.au
Yi Mu, University of Wollongong, Australia
ymu@uow.edu.au
Yunghsiang S. Han, National Taipei University, Taiwan
yshan@mail.ntpu.edu.tw
Zhaoyu Liu, University of North Carolina at Charlotte, USA
zhliu@uncc.edu
Yingwu Zhu, Seattle University, USA
zhuy@seattleu.edu


Main Track

Tei-Wei Kuo, National Taiwan University, Taiwan
ktw@csie.ntu.edu.tw

Chih-Yuan Huang, GLOBAL UNICHIP Corp., Taiwan
alex.huang@globalunichip.com
Young-Sik Jeong, Wonkwang University, Korea
Aysjeong@wku.ac.kr
Bernd Kleinjohann, University of Paderborn, Germany
bernd@c-lab.de
Chin-Fu Kuo, National University of Kaohsiung, Taiwan
chinfukuo2006@nuk.edu.tw
Chi-Sheng Shih, National Taiwan University, Taiwan
cshih@csie.ntu.edu.tw
Zili Shao, Hong-Kong Polytech University, Hong Kong
cszlshao@comp.polyu.edu.hk
Chih-Wen Hsueh, National Taiwan University, Taiwan
cwhsueh@csie.ntu.edu.tw
Doohyun Kim, Konkuk University, Korea
doohyun@konkuk.ac.kr
Shih-Hao Hung, National Taiwan University, Taiwan
hungsh@csie.ntu.edu.tw
Ken-ichi Itoh, Siedold University of Nagasaki, Japan
ito@sun.ac.jp
Jen-Wei Hsieh, National Chiayi University, Taiwan
jenwei@mail.ncyu.edu.tw
Jun Wu, National Pingtung Institute of Commerce, Taiwan
junwu@npic.edu.tw
Jianwu Zhang, Hangzhou Dianzi University, China
jwzhang@hdu.edu.cn
Lung-Jen Wang, National Pingtung Institute of Commerce, Taiwan
ljwang@npic.edu.tw
Nei-Chiung Perng, Genesys Logic, Taiwan
Neil.Perng@genesyslogic.com.tw
Shi-Wu Lo, National Chung-Cheng University, Taiwan
shiwulo@cs.ccu.edu.tw
Ting-Ao Tang, Fudan University, China
tatang@fudan.edu.cn
Tai-Yi Huang, National Tsing Hua University, Taiwan
tyhuang@cs.nthu.edu.tw
Xiaoyang Zeng, Fudan University, China
xyzeng@fudan.edu.cn
Chia-Lin Yang, National Taiwan University, Taiwan
yangc@csie.ntu.edu.tw
Cheng-Zhong Xu, Wayne State University, USA
czxu@wayne.edu
Dakai Zhu, University of Texas at San Antonio, USA
dzhu@cs.utsa.edu