CALL FOR PAPERS

International Journal of Embedded Systems
(http://www.inderscience.com/catalogue/e/ijes/indexijes.html, 
Inderscience Publishers)

Special Issue On Hardware-Software Codesign for Systems-on-Chip
(http://www.cs.ccu.edu.tw/~pahsiung/ijes-codesign/)

DEADLINE EXTENDED: December 15, 2003

With the rapidly permeating global trend of adopting SoC (System-on-Chip) 
design technologies, traditional hardware-software codesign techniques 
need adaptation and revamping to satisfy the growing needs of complex 
system designs. This special issue is devoted to presenting 
state-of-the-art SoC codesign and coverification methodologies, 
languages, techniques, tools, system architectures, and related 
technologies. Prospective papers should be unpublished and present solid 
research work offering innovative contributions either from a 
methodological or application point of view.

Topics of interest include (but are not limited to):

* Design & Verification Methodologies
* Design & Verification Languages
* Design & Verification Tools
* SoC Architectural Issues
* SoC Physical Impact on Codesign
* Nanotechnology and Codesign
* Mixed-Signal in Codesign
* Soft/Hard IP-reuse in Codesign
* Embedded Software Issues
* Embedded Hardware Issues
* Communication Issues
* Cosimulation Techniques
* (Semi)-Formal Verification
* Platform-Based Codesign Issues

Prospective authors should follow the Inderscience IJES manuscript format 
described at the Journal site 
http://www.inderscience.com/catalogue/e/ijes/indexijes.html. An electronic 
copy of the complete manuscript in PDF format is to be submitted by e-mail 
to Pao-Ann Hsiung at hpa@computer.org, according to the following schedule.

Manuscript due:          December 15, 2003 (Extended and Hard!!!)
Acceptance notification: January 31, 2004
Final manuscript due:    February 6, 2004
Publication date:        June 2004

Guest Editor
Prof. Pao-Ann Hsiung
Department of Computer Science and Information Engineering
National Chung Cheng University
Chiayi 621, Taiwan
hpa@computer.org

Editorial Board for this Special Issue: (ordered alphabetically)
Jih-Ming Fu, Cheng-Shiu University of Technology, Taiwan
Rajesh Gupta, University of California, Irvine, USA
Thomas Henzinger, University of California, Berkeley, USA
Luciano Lavagno, Politecnico di Torino, Italy
Trong-Yen Lee, National Taipei University of Technology, Taiwan
Win-Bin See, Aerospace Industrial Development Corporation, Taiwan
Wayne Wolf, Princeton University, USA