Notification Extended: January 31, 2004
Call for Papers
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With the rapidly permeating global trend of adopting SoC (System-on-Chip)
design technologies, traditional hardware-software codesign techniques need
adaptation and revamping to satisfy the growing needs of complex system
designs. This special issue is devoted to presenting state-of-the-art SoC
codesign and coverification methodologies, languages, techniques, tools,
system architectures, and related technologies. Prospective papers should be
unpublished and present solid research work offering innovative contributions
either from a methodological or application point of view.
Scope
Topics of interest include (but are not limited to):
| Design & Verification Methodologies | Soft/Hard IP-reuse in Codesign
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| Design & Verification Languages | Embedded Software Issues
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| Design & Verification Tools | Embedded Hardware Issues
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| SoC Architectural Issues | Communication Issues
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| SoC Physical Impact on Codesign | Cosimulation Techniques
|
| Nanotechnology and Codesign | (Semi)-Formal Verification
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| Mixed-Signal in Codesign | Platform-Based Codesign Issues
|
Paper Format
The format of the paper should be as detailed in the following URL:
http://www.inderscience.com/catalogue/e/ijes/indexijes.html.
Basically, it is IEEE Transactions style, either in Word or Latex2E,
not exceeding 6000 words (which is no more than 15 pages of the journal).
Paper Submission
Submit papers to the guest editor by sending your manuscript in PDF format
as an attachment to an e-mail. Guest Editor E-mail: hpa@computer.org
Important Dates
Manuscript due: December 15, 2003 (Extended and Hard!!!)
Acceptance notification: January 31, 2004
Final manuscript due: February 6, 2004
Publication date: June 2004
Guest Editor
Pao-Ann Hsiung
Department of Computer Science and Information Engineering
National Chung Cheng University
Chiayi, Taiwan-621, R.O.C.
Editorial Board
- Jih-Ming Fu, Cheng-Shiu University of Technology, Taiwan
- Rajesh Gupta, University of California, Irvine, USA
- Thomas Henzinger, University of California, Berkeley, USA
- Luciano Lavagno, Politecnico di Torino, Italy
- Trong-Yen Lee, National Taipei University of Technology, Taiwan
- Win-Bin See, Aerospace Industrial Development Corporation, Taiwan
- Wayne Wolf, Princeton University, USA
Last Updated: 2 December, 2003